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Semiconductor Constants
This section includes information on properities of silicon, germanium, gallium arsenide, and other semiconductors.
- Properties of Si
Crystal Properties
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Atoms/cm3
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5.0e22
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Atomic weight
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28.086
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Crystal
structure
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Diamond
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Density
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~3e5
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Lattice Constant
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5.4310 A
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Band structure Properties
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Dielectric constant
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11.9
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Eff. Density of states (conduction, Nc)
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2.8e19 cm-3
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Eff. Density of states (valence, Nv
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1.04e19 cm-3
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Electron affinity
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4.05
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Minimum Indirect Energy Gap (300K)
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1.12 eV
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Minimum Direct Energy Gap
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3.4 eV
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Intrinsic Carrier concentration
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1.45e10 cm-3
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Intrinsic Debye length
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24 um
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Intrinsic resistivity
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2.3e5 ohm-cm
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Minority carrier lifetime
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2.5e-3 s
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Mobility (drift) (cm2/V-s)
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1500(electron);450(hole)
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Thermal Properties
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Linear coefficient of thermal expansion
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2.6e-6 (degC-1)
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Melting point
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1414 degC (estimated)
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Boiling Point
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2878degC
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Specific heat
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0.7 J/g-degC
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Thermal conductivity @ 300K
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1.5 W/cm-degC
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Thermal diffusivity
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0.99 cm2/s
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Vapor Pressure (Pa)
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1@1650degC; 1e-6@900degC
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Other Properties
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Hardness
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1150 kg/mm2
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Compressibility coefficient
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1.0 cm2/dyne
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Bulk modulus
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9.8 dyne/cm2
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Young’s modulus
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1.3 dyne/cm2
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Coefficient of thermal expansion
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2.33 /degC
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dn/dT
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1.2 degC
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Elastic constant, C11
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1.656 dyne/cm2
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Elastic constant, C12
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0.639 dyne/cm2
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Elastic constant, C44
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0.795 dyne/cm2
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Breaking strength, compression
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4900-5600 Kg/cm2
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Rupture modulus, bending
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700-3500 Kg/cm2
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- Properties of Ge
Crystal structure |
Diamond |
Auger recombination coefficient |
10-30 cm6/s |
Debye temperature |
374 K |
Density |
5.3234 g/cm3 |
Dielectric constant |
16.2 |
Effective electron masses ml |
1.6mo |
Effective electron masses mt |
0.08mo |
Effective hole masses mh |
0.33mo |
Effective hole masses mlp |
0.043mo |
Electron affinity |
4.0 eV |
Lattice constant |
5.658 A |
Optical phonon energy |
0.037 eV |
Breakdown field |
˜105V cm-1 |
Mobility electrons |
=3900 cm2 V-1s-1 |
Mobility holes |
=1900 cm2 V-1s-1 |
Diffusion coefficient electrons |
=100 cm2 s-1 |
Diffusion coefficient holes |
=50 cm2 s-1 |
Electron thermal velocity |
3.1·105m s-1 |
Hole thermal velocity |
1.9·105m s-1 |
Infrared refractive index n |
4.00 |
Radiative recombination coefficient |
6.4·10-14 cm3/s |
Bulk modulus |
7.5·1011 dyn cm-2 |
Melting point |
937 °C |
Specific heat |
0.31 J g-1 °C-1 |
Thermal conductivity |
0.58 W cm-1 °C-1 |
Thermal diffusivity |
0.36 cm2s-1 |
Thermal expansion, linear |
5.9·10-6 °C -1 |
Bulk modulus |
7.5·1011 dyn cm-2 |
Melting point |
937 °C |
Specific heat |
0.31 J g-1 °C-1 |
Thermal conductivity |
0.58 W cm-1 °C-1 |
Thermal diffusivity |
0.36 cm2s-1 |
Thermal expansion, linear |
5.9·10-6 °C -1 |
Bulk modulus |
7.5·1011dyn cm-2 |
Density |
5.323 g cm-3 |
Cleavage plane |
{ 001 } |
Elastic Modulus C11 |
12.60·1011 dyn cm-2 |
C12 |
4.40·1011 dyn cm-2 |
C44 |
6.77·1011 dyn cm-2 |
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- Properties of GaAs
Crystal structure |
Zinc Blende |
de Broglie electron wavelength |
240 A |
Debye temperature |
360 K |
Density |
5.32 g cm-3 |
Dielectric constant (static ) |
12.9 |
Dielectric constant (high frequency) |
10.89 |
Effective electron mass me |
0.063mo |
Effective hole masses mh |
0.51mo |
Effective hole masses mlp |
0.082mo |
Electron affinity |
4.07 eV |
Lattice constant |
5.65325 A |
Optical phonon energy |
0.035 eV |
Energy gap |
1.424 eV |
Energy separation (EΓL) between Γ and L valleys |
0.29 eV |
Energy separation (EΓX) between Γ and X valleys |
0.48 eV |
Energy spin-orbital splitting |
0.34 eV |
Intrinsic carrier concentration |
2.1·106 cm-3 |
Intrinsic resistivity |
3.3·108 Ω·cm |
Effective conduction band density of states |
4.7·1017 cm-3 |
Effective valence band density of states |
9.0·10-18 cm-3 |
Breakdown field |
≈4·105 V/cm |
Mobility electrons |
≤8500 cm2 V-1s-1 |
Mobility holes |
≤400 cm2 V-1s-1 |
Diffusion coefficient electrons |
≤200 cm2/s |
Diffusion coefficient holes |
≤10 cm2/s |
Electron thermal velocity |
4.4·105 m/s |
Hole thermal velocity |
1.8·105m/s |
Infrared refractive index |
3.3 |
Radiative recombination coefficient |
7·10-10 cm3/s |
Bulk modulus |
7.53·1011 dyn cm-2 |
Melting point |
1240 °C |
Specific heat |
0.33 J g-1°C -1 |
Thermal conductivity |
0.55 W cm-1 °C -1 |
Thermal diffusivity |
0.31cm2s-1 |
Thermal expansion, linear |
5.73·10-6 °C -1 |
Bulk modulus | 7.53·1011
dyn cm-2 | Density | 5.317 g cm-3 |
Cleavage plane | {110} | Piezoelectric constant | e14=-0.16
C m-2 |
C11 | 11.90·1011 dyn/cm2 |
C12 | 5.34·1011 dyn/cm2 |
C44 | 5.96·1011 dyn/cm2 |
- Properties of Select Binary Semiconductors
Parameter
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AlP
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AlAs
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AsSb
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GaP
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GaAs
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GaSb
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InP
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InAs
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InSb
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Direct
Energy Gap
(eV@300K)
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Γ15- Γ1
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3.62
(77K)
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3.14
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2.22
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2.78
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1.424
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0.70
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1.34
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0.356
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0.180
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Direct Energy Gap
(eV @0K)
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Eg = Ego - αT2/(T+β)
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Eg
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2.52
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2.239
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1.687
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2.338
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1.519
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0.810
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1.421
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0.420
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0.236
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α (10-4eV/K)
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3.18
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6.0
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4.97
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5.771
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5.405
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3.78
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3.63
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2.50
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2.99
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β
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588
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408
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213
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372
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204
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94
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162
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75
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140
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Indirect Energy Gap
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Γ15- X1
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2.45
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2.14
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1.63
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2.268
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1.804
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1.25
(10K)
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2.74
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--
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--
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Temperature
dependence or direct and indirect energy gap
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dEd/dT
dEind/dT
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-3.6
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-5.2
-4.0
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-3.5
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-4.5
-5.2
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-3.9
-2.4
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-3.7
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-2.9
-3.7
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-3.5
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-2.8
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Indirect Energy Gap
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Γ15- L1
|
--
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--
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--
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--
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1.81
(110K)
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0.81
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1.74
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--
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--
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Lattice Constant
(Å)
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5.467
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5.660
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6.136
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5.4512
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5.6532
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6.0959
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5.8687
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6.0583
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6.4794
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Density (gm cm-3)
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2.40
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3.70
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4.26
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4.138
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5.3161
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5.6137
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4.81
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5.667
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5.7747
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Melting Point (K)
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2823
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2013
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1338
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1740
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1513
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985
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1335
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1215
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800
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Coefficient of
Thermal Expansion 10-6/°C (@300K)
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4.5
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4.9
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4.0
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4.5
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6.86
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7.75
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4.75
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4.52
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5.37
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Thermal
Conductivity
(W cm-1 K-1)
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0.9
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0.8
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0.57
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0.77
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0.46
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0.39
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0.68
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0.273
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0.166
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Refractive index n
(near Eg)
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3.03
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3.18
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3.4
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3.45
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3.65
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3.82
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3.41
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3.52
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4.00
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Dielectric constant
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static ε(0)
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9.8
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10.06
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12.04
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11.1
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12.91
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15.69
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12.61
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15.15
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17.7
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high f ε(∞)
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7.54
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8.16
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10.24
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9.08
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10.9
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14.44
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9.61
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12.25
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15.68
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(1/n)*(dn/dT)*(K-1) x10-5
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3.5
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4.6
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3.5
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2.5
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4.5
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8.2
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2.7
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6.5
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0.12
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Elastic Compliances
(10-12 cm2 dyne-1)
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S11
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1.090
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1.070
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1.696
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0.973
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1.176
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1.582
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1.650
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1.945
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2.443
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S12
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-0.350
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-0.320
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-0.562
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-0.298
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-0.365
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-0.495
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-0.594
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-0.685
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-0.863
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S44
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1.630
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1.840
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2.453
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1.419
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1.684
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2.314
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2.170
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2.525
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3.311
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Properties of Ternary Semiconductors
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