Denton Vacuum E-beam Evaporator Denton Vacuum - Quality, Service, Value 1259 North Church St. Moorestown, NJ, USA 08057 856-439-9100 www.dentonvacuum.com Contact Information:   Faculty Contact:   Aaron Hawkins   Staff Contact:   Joe Bussio   Student Contact:   John Stout Maintenance Request for Denton Vacuum E-beam Evaporator SCHEDULER IS REQUIRED

NOTE:

• All depositions must be approved by Dr. Hawkins
• Do NOT deposit anything containing iron. The only materials that can be deposited are Ni, SiO₂, Al, Au, Cr, Ti, SnO₂, Ge
• Never operate the high vacuum (TURBO) pump without the roughing (MECH) pump being on

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1. General Information

   1. The Denton Vacuum E-beam Evaporator is primarily used to deposit metal on silicon wafers. For these depositions to occur, the wafer and material to be deposited must first be brought to a very low pressure (high vacuum). This vacuum is usually in the range of 1x10^-5 torr. The material to be deposited must be capable of vaporizing for the deposition to be successful. Once at a high vacuum, an electron beam is focused on the crucible containing the deposition material until the material begins to evaporate. As the material in the crucible evaporates, its vapor will begin to coat the inside surface of the chamber. The Inficon Deposition Meter utilizes a quartz crystal monitor to accurately display the thickness and rate of the deposition. Also, a shutter is used to block the electron beam from hitting the deposition material until everything is ready for the deposition.
      
      

2. Equipment Specifications

   1. LCD Touch-screen
      1. Click on image to see location on E-beam
         
   2. Inficon Deposition Monitor
      1. Click on image to see location on E-beam
         
   3. Sightglass and Mirror Stand
      1. Click on image to see location on E-beam
         
   4. Chiller
      1. 

3. Operating Procedures

   1. Vent Chamber:
      1. Turn Roughing Valve off
      2. Turn Mechanical pump off
      3. Push Vent (should then go down to atm pressure)
   2. Load:
      1. Check crystal life
      2. Load crucible
      3. Load substrate
      4. Align mirrors
   3. Evacuate:
      1. Follow sheet on Ebeam for evacuation procedures
         1. Close door
         2. Press Mech pump green light on
         3. Press Rough valve green light on
         4. Wait for chamber TC to read 1.0 E-1 torr, or lower
         5. Press Rough valve Green light off
         6. Press High vac valve green light on
         7. Wait for chamber TC to read High vac
         8. Press Ion gauge emission green light on
         9. Wait for chamber IG to read 5.5 E-5 torr or lower
      2. Preparation during evacuation phase:
         1. (on deposition monitor)
         2. Push program
         3. Set tooling factor 1&2 (set both as same)
         4. Set density
         5. Set z-factor
         6. Push program to exit screen
         7. (on ebeam monitor)
         8. Close shutter
         9. Turn on power to rotation
   4. Deposition:
      1. Turn power on (deposition monitor; must wait at least 2 min before running current)
      2. Turn Volt/Emission on
      3. Push start
      4. Push zero
      5. Slowly ramp current to level
      6. Open shutter
      7. Wait for desired thickness
      8. Close shutter
      9. Turn current down slowly
      10. Turn off Voltage/Emission
      11. Wait at least 2 min to turn power off
   5. After Deposition:
      1. Turn power off (must wait at least 2 min after turning the emission off)
      2. Press Ion gauge emission green light off
      3. Press High vac valve green light off
      4. Press Mech pump green light off
      5. Press Vent
   6. Stand by mode:
      1. Pump down to or below 100 torr using mech pump
      2. Close Roughing valve and turn off Mech pump
      3. Turn off Deposition monitor