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Thin SU-8 Film Lithography - Curing Images
SU-8 is an epoxy based photoresist.
Experimental Procedure
Wafer Preparation
Clean Wafer
Dehydration Bake Wafer
Spin Coat
Cover the Solitec spinner's drain and plastic top with a cleanroom wipe.
Mount the wafer on the Solitec spinner.
Apply a quarter sized puddle of SU-8 to wafer.
Ramp to 500 rpm at 100rpm/s (5 seconds)
Ramp to 6500 rpm at 300rpm/s (20 seconds).
Hold at 6500 rpm for 40 seconds
Softbake
Heat the Cole-Parmer hotplate to 65°C
Place the wafer on the hotplate
Set the timer to 2 minutes
When the time is up change the temperature to 95°C
Set the timer to 5 minutes
When the time is up transfer the wafer to a wafer holder
Exposure
On the
Karl Suss
aligner expose the wafer for 12 seconds.
Post Exposure Bake
Heat the Cole-Parmer hotplate to 65°C
Place the wafer on the hotplate
Set the timer to 1 minute
When the time is up change the temperature to 95°C
Set the timer to 2 minutes
When the time is up transfer the wafer to a wafer holder
Development
Place some SU-8 developer in a glass plate
Place the wafer in the developer for 2 minutes
The development is very sensitive to the concentration of the developer. After developing a few wafers the development time might need to be increased or new developer should be used.
Curing
Heat the
clean oven
to 65°C
Place the wafer in a metal wafer carrier
Place the metal carrier in the oven
Set the
clean oven
to 200°C. This will cause the temperature to ramp up as fast as possible.
Set a clean room timer to 30 minutes
When the time is up remove the metal carrier from the oven
Results
Channel Width (um) x Separation (um)
Cured
Not Cured
2x2
2x8
4x4
4x32
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